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Received:September 05, 2007Revised:March 10, 2008 |
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Analysis of on-chip distributed interconnects based on Pade expansion |
Xiaopeng JI, Long GE, Zhiquan WANG |
(College of Automation, Nanjing University of Science and Technology, Nanjing Jiangsu 210094, China) |
Abstract: |
In this paper, on-chip interconnects are modeled as distributed parameter RLCG transmission lines, based on which the matrix ABCD of interconnects is deduced. With help of the ABCD matrix, a voltage transfer function of an interconnect system, consisting of a driver, interconnect line and load, is obtained analytically in the form of a transcendental function, and it is reduced to a finite order system based on high order Pade approximation. With the reduced-order transfer function, response waveforms with step input can be obtained, and signal delay can be calculated consequently. Two numerical experiments are conducted to demonstrate its efficiency. |
Key words: Distributed interconnects ABCD matrix Transfer function Pade expansion Response waveform Signal delay |